Cashless RFID PoC

Assembled first spin of RFID design on a smaller board. This was to test functionality and range of the RFID. 

After applying solder paste, components were carefully placed by hand.

Once board was reflowed, some final tuning of the RF Antenna and impedence were made. 

Final result for PoC.

Second spin with a new PCB layout and deesign.

Similar process with Kapton Stencil and Solder Paste.

New board design to fit enclosure features

Third revision, small changes

Final PCB layout design, more by hand assembly. 

Flashing final FW and updating code to verify functionality

Testing All boards, making sure they interface well with our off the shelf tablet and payment system

Final products for Launch Test Event. Assembled each PCBA, tablet, payment system inside custom enclosure.